Stacked image sensor and system including the same

ABSTRACT

A stacked image sensor includes a first semiconductor die and a second semiconductor die. The first semiconductor die includes a pixel array of rows and columns of pixels, a first column interlayer-connection unit extending in the row direction and disposed adjacent the top or bottom of the pixel array and column routing wires extending in a diagonal direction and connecting the pixel columns and the first column interlayer-connection unit. The second semiconductor die is stacked with the first semiconductor die. The second semiconductor die includes a second column interlayer-connection unit extending in the row direction and disposed at a location corresponding to the first column interlayer-connection unit and connected to the first column interlayer-connection unit, and a column control circuit connected to the second column interlayer-connection unit.

PRIORITY STATEMENT

This is a Continuation of U.S. application Ser. No. 15/165,725, filedMay 26, 2016, which claims priority under 35 USC § 119 to Korean PatentApplication No. 10-2015-0108429, filed on Jul. 31, 2015, in the KoreanIntellectual Property Office (KIPO), the disclosure of which isincorporated by reference in its entirety herein.

BACKGROUND 1. Technical Field

The inventive concept relates generally to image sensors comprising apackage of stacked semiconductor integrated circuits (dies) and toelectronic systems including such image sensors.

2. Discussion of the Related Art

Recently, the demand for more highly functional and compact mobiledevices such as smart phones, tablet computers, etc. requires theminiaturization of components, e.g., packaged components, and featuresof the devices by means of high integration and high packagingtechniques. One of these components sought to be miniaturized is animage sensor package. To lower the manufacturing costs of such packages,in addition to providing for their miniaturization, one semiconductordie may be provided with a pixel array while the other circuits may beprovided in another semiconductor die and then the two semiconductordies are stacked. However, due to process margins associated with theirdesign, current image sensors including stacked dies do not allow for adesired level of miniaturization to be realized in electronic devicesand especially mobile devices such as smart phones, tablet computers,etc.

SUMMARY

An image sensor according to the inventive concept comprises a firstsemiconductor die including a pixel array of rows and columns of pixels,first column interlayer-connection structure whose footprint iselongated in a row direction and lies adjacent to one of first andsecond opposite sides of the pixel array, and column routing wiresextending linearly in a diagonal direction and connecting the columns ofpixels independently of one another to the first columninterlayer-connection structure, and a second semiconductor die stackedwith and joined to the first semiconductor die, the second semiconductordie including second column interlayer-connection structure and columncontrol circuitry. The second column interlayer-connection structure iselectrically connected to the first column interlayer-connection unit,the footprint of the second column interlayer-connection structure iselongated in the row direction and occupies a position verticallycorresponding to that of the first column interlayer-connectionstructure in the stack of the first and second semiconductor dies, andthe column control circuitry is electrically connected to the secondcolumn interlayer-connection structure. Here, the row direction refersto the direction parallel to the rows of pixels, and the diagonaldirection refers to a direction that subtends an acute angle with therow direction.

An image sensor according to the inventive concept comprises a firstsemiconductor die including a pixel array of rows and columns of pixels,first column interlayer-connection structure disposed adjacent to one offirst and second opposite sides of the pixel array and having afootprint that is elongated in a row direction, first rowinterlayer-connection structure disposed adjacent to one of third andfourth opposite sides of the pixel array and having a footprint that iselongated in a column direction, column routing wires electricallyconnecting the columns of pixels independently of one another to thefirst column interlayer-connection structure, and row routing wireselectrically connecting the rows of pixels independently of one anotherto the first row interlayer-connection structure; and a secondsemiconductor die stacked with and joined to the first semiconductor dieand including second column interlayer-connection structure electricallyconnected to the first column interlayer-connection structure, secondrow interlayer-connection structure electrically connected to the firstrow interlayer-connection structure, column control circuitryelectrically connected to the second column interlayer-connectionstructure, and row control circuitry electrically connected to thesecond row interlayer-connection unit. The footprint of the secondcolumn interlayer-connection structure is elongated in the row directionand lies at a position aligned, in the direction in which the dies arestacked, with that of the first column interlayer-connection unit. Thefootprint of the second row interlayer-connection structure is elongatedin the column direction and lies at a position, aligned, in thedirection in which the dies are stacked, with that of the first rowinterlayer-connection structure. Also, the column routing wires and/orthe row routing wires are linear wires extending lengthwise in adiagonal direction that subtends acute angles with the row direction andthe column direction, respectively.

A system, according to the inventive concept, comprises a processor anda stacked image sensor controlled by the processor. The stacked imagesensor includes a first semiconductor die and a second semiconductordie. The first semiconductor die includes a pixel array in which pixelsare arranged in pixel rows and pixel columns, a first columninterlayer-connection unit extended in a row direction and disposedadjacent to a top side or a bottom side of the pixel array and columnrouting wires extended in a diagonal direction to connect the pixelcolumns and the first column interlayer-connection unit. The secondsemiconductor die is stacked with the first semiconductor die. Thesecond semiconductor die includes a second column interlayer-connectionunit extended in the row direction and disposed at a positioncorresponding to the first column interlayer-connection unit to beconnected to the first column interlayer-connection unit and a columncontrol circuit connected to the second column interlayer-connectionunit.

Still further, an image sensor according to the inventive conceptcomprises first and second dies stacked one on the other and joined toeach other, the first die including a semiconductor substrate, a pixelarray, and routing wires, and the second die including a semiconductorsubstrate, and pixel array control circuitry. The pixel array comprisesrows and columns of pixels, column data lines each of which electricallyconnects the pixels in a respective column of the pixels, and rowselection lines each of which electrically connects the pixels in arespective row of the pixels, the pixels in each of the rows beingarrayed in a first direction, and the pixels in each of the columnsbeing arrayed in a second direction. The routing wires comprise columnrouting wires electrically connected to the column data lines at ends ofthe column data lines, respectively, and by which all of the pixels ofthe pixel array are electrically connected to the pixel array controlcircuitry of the second die, and row routing wires electricallyconnected to the row selection lines at ends of the row selection lines,respectively and by which all of the pixels of the pixel array areelectrically connected to the pixel array control circuitry of thesecond die. Also, all of the row routing wires and/or all of the columnrouting wires are linear, and extend lengthwise within the same layer inthe first die parallel to one another in a diagonal direction thatsubtends acute angles with the first and second directions,respectively.

BRIEF DESCRIPTION OF THE DRAWINGS

Examples of the inventive concept will be more clearly understood fromthe following detailed description taken in conjunction with theaccompanying drawings.

FIG. 1 is a perspective view of a stacked image sensor according toexamples.

FIG. 2 is a diagram illustrating a disassembled state of the stackedimage sensor of FIG. 1.

FIGS. 3 and 4 are diagrams illustrating a slide routing structureadopted in the stacked image sensor of FIG. 1.

FIG. 5 is a block diagram illustrating a stacked image sensor accordingto examples.

FIGS. 6A and 6B are diagrams illustrating a layout of a stacked imagesensor according to examples.

FIGS. 7A through 7D are diagrams illustrating example pixels included inthe stacked image sensor of FIG. 5.

FIG. 8 is a cross-sectional view of a stacked image sensor according toan example.

FIG. 9 is a diagram illustrating a slide routing structure implementedin the stacked image sensor of FIG. 8.

FIG. 10 is a cross-sectional view of a stacked image sensor according toan example.

FIG. 11 is a diagram illustrating a slide routing structure implementedin the stacked image sensor of FIG. 10.

FIG. 12 is a cross-sectional view of a stacked image sensor according toan example.

FIG. 13 is a diagram for describing manufacturing processes of a stackedimage sensor according to examples.

FIG. 14 is a diagram illustrating a camera system including a stackedimage sensor according to examples.

FIG. 15 is a diagram illustrating a computer system including a stackedimage sensor according to examples.

FIG. 16 is a block diagram illustrating an interface employable in thecomputer system of FIG. 15.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The inventive concept will be described more fully hereinafter withreference to the accompanying drawings, in which some examples accordingto the inventive concept are shown. The inventive concept may, however,be embodied in many different forms and should not be construed aslimited to the examples set forth herein. Rather, these examples areprovided so that this disclosure will be thorough and complete, and willfully convey the scope of the inventive concept to those skilled in theart. In the drawings, the sizes and relative sizes of layers and regionsmay be exaggerated for clarity. Like numerals designate like elementsthroughout.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are used to distinguish oneelement from another. Thus, a first element discussed below could betermed a second element without departing from the teachings of thepresent disclosure. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present. Other words used to describe therelationship between elements should be interpreted in a like fashion(e.g., “between” versus “directly between,” “adjacent” versus “directlyadjacent,” etc.).

The terminology used herein is for the purpose of describing particularexamples only and is not intended to be limiting. As used herein, thesingular forms “a,” “an” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. It willbe further understood that the terms “comprises” and/or “comprising,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, and/or components, butdo not preclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. Forexample, the term “footprint” will be understood as generally referringto the outline of structure as viewed in plan as representative of thearea occupied by the structure. Also, the term die will be understood asa unit including a substrate, such as semiconductor substrate, andintegrated circuitry, and which may have one or more insulating orinter-layer insulating layers (e.g., dielectric layers) on thesubstrate. Therefore, when features are described as being part of “thesame layer” such a description will be understood as referring to thefact the features are confined within or to a surface of a substrate orlayer that has been formed on the substrate. It will be furtherunderstood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

FIG. 1 is a perspective view of a stacked image sensor according toexamples, and FIG. 2 is a diagram illustrating a disassembled state ofthe stacked image sensor of FIG. 1. Also, FIGS. 1 and 2 are schematic innature in that they illustrate the footprints of various connectionstructure and circuitry described in more detail below.

Referring to FIGS. 1 and 2, a stacked image sensor 10 includes a firstsemiconductor die 100 and a second semiconductor die 200 that arestacked in a vertical direction Z. For example, the first semiconductordie 100 may be stacked on the second semiconductor die 200 asillustrated in FIGS. 1 and 2.

The first semiconductor die 100 may include a pixel array 110, a firstcolumn interlayer-connection unit 120, column routing wires 130, a firstrow interlayer-connection unit 140 and row routing wires 150.

Pixels PX are arranged in pixel rows and pixel columns in the pixelarray 110 as illustrated in FIG. 5. The first columninterlayer-connection unit 120 extends lengthwise in a row direction Xand is disposed adjacent to a top side or a bottom side of the pixelarray 110. The first row interlayer-connection unit 140 extendslengthwise in a column direction Y and is disposed adjacent to a leftside or a right side of the pixel array 110. For example, as illustratedin FIGS. 1 and 2, the first column interlayer-connection unit 120 may bedisposed adjacent to the bottom side of the pixel array 110 and thefirst row interlayer-connection unit 140 may be disposed adjacent to theright side of the pixel array 110. The column routing wires 130 connectthe pixel columns and the first column interlayer-connection unit 120.The row routing wires 150 connect the pixel rows and the first rowinterlayer-connection unit 140.

The second semiconductor die 200 may include a second columninterlayer-connection unit 220, a column control circuit CCC 230, asecond row interlayer-connection unit 240 and a row control circuit RCC250.

The second column interlayer-connection unit 220 extends lengthwise inthe row direction X and is disposed at a position corresponding to thefirst column interlayer-connection unit 120 so that the second columninterlayer-connection unit 220 may be connected to the first columninterlayer-connection unit 120 when the first semiconductor die 100 andthe second semiconductor die 200 are stacked. The second rowinterlayer-connection unit 240 extends lengthwise in the columndirection Y and is disposed at a position corresponding to the first rowinterlayer-connection unit 140 so that the second rowinterlayer-connection unit 240 may be connected to the first rowinterlayer-connection unit 140 when the first semiconductor die 100 andthe second semiconductor die 200 are stacked. The column control circuit230 is connected to the second column interlayer-connection unit 220 andthe row control circuit 250 is connected to the second rowinterlayer-connection unit 240. Accordingly, the column control circuit230 of the second semiconductor die 200 may be connected to the pixelcolumns in the pixel array 110 of the first semiconductor die 100through the column routing wires 130, the first columninterlayer-connection unit 120 and the second columninterlayer-connection unit 220. The row control circuit 250 disposed inthe second semiconductor die 200 may be connected to the pixel rows inthe pixel array 110 disposed in the first semiconductor die 100 throughthe row routing wires 150, the first row interlayer-connection unit 140and the second row interlayer-connection unit 240.

As described below, each of the interlayer-connection units 120, 140,220 and 240 may include bonding pads formed on a surface of thesemiconductor die, vertical contacts of the dielectric layer of thesemiconductor die and/or through-substrate vias penetrating thesemiconductor substrate of the semiconductor die. The column controlcircuit 230 may include comparators, counters and correlated doublesampling circuits to convert the analog signals from the pixel columnsin the pixel array 110 to digital signals. The row control circuit 250may include drivers to apply predetermined voltages to the pixel rows inthe pixel array 110. Even though not illustrated in FIG. 2, the secondsemiconductor die 200 may also include a timing controller, a referencesignal generator, a digital circuit etc.

According to examples, the column routing wires 130 and/or the rowrouting wires 150 may have a slide routing structure in which the wiresextend linearly in a diagonal direction. The diagonal direction may bean arbitrary direction that is parallel with the top and bottom surfacesof the semiconductor die and is not parallel with the row direction Xand the column direction Y. Using such slide routing structure, thestacked image sensor 10 may possess a relatively great margin inconnection with the design of its circuitry and a relatively small size,i.e., may have a high degree of miniaturization. In addition, loadsalong the conductive paths between the pixel array 110 and the columncontrol circuit 230 and/or between the pixel array 110 and the rowcontrol circuit 250 may be highly uniform in the stacked image sensor 10to enhance the performance of the stacked image sensor 10 and the systemincluding the stacked image sensor 10.

FIGS. 3 and 4 are diagrams illustrating a slide routing structureadopted in the stacked image sensor of FIG. 1.

FIG. 3 illustrates an example in which a slide routing structure isimplemented in the first column interlayer-connection unit 120 and thecolumn routing wires 130 and FIG. 4 illustrates an example in which aslide routing structure is implemented in the first rowinterlayer-connection unit 140 and the row routing wires 150.

Referring to FIG. 3, the pixel columns of the pixel array 110 of thefirst semiconductor die 100 may be respectively connected to the columndata lines CDL as illustrated in FIG. 5. A pitch PTX1 between the pixelcolumns may be defined as an interval between the two adjacent columndata lines CDL. The first column interlayer-connection unit 120 mayinclude first column bonding pads PAD1 arranged in the row direction X.The first column bonding pads PAD1 may be disposed on a surface of thefirst semiconductor die 100 that is bonded to a surface of the secondsemiconductor die 200 as illustrated in FIG. 8. The column routing wires130 may be of the dielectric layer of the first semiconductor die 100and thus the column routing wires 130 may be connected to the firstcolumn bonding pads PAD1 on the surface of the first semiconductor die100 through vertical contacts.

According to examples, the column routing wires 130 extend linearly inthe diagonal direction to connect the column data lines CDL and thefirst column bonding pads PAD1, respectively. A row-directional lengthLX1 of the pixel array 110 may be equal to a row-directional length ofthe first column interlayer-connection unit 120 and the column routingwires 130 may be parallel to each other. The first columninterlayer-connection unit 120 may be placed in a parallel-translatedposition along (i.e., may be offset in) the row direction X with respectto the pixel array 110 such that a row-directional center position CX2of the first column interlayer-connection unit 120 is different from arow-directional center position CX1 of the pixel array 110.

The second column interlayer-connection unit 220 may be disposed in thesecond semiconductor die 100 at a position corresponding to the firstcolumn interlayer-connection unit 120 so that the second columninterlayer-connection unit 220 may be connected to the first columninterlayer-connection unit 120 when the first semiconductor die 100 andthe second semiconductor die 200 are stacked. The second columninterlayer-connection unit 220 may include second column bonding padsPAD2 arranged in the row direction X that are vertically aligned withand connected to the first column bonding pads PAD1 when thesemiconductor dies 100 and 200 are stacked. The second column bondingpads PAD2 may be disposed on a surface of the second semiconductor die200 that is bonded to a surface to the first semiconductor die 100 andthus, each first column bonding pads PAD1 may be disposed inface-to-face electrical contact with a second column bonding pad PAD2 asillustrated in FIG. 8.

The column control circuit 230 may include a plurality of column unitcircuits CU respectively connected to the pixel columns, that is, to thecolumn data lines CDL, through the column routing wires 130, the firstcolumn interlayer-connection unit 120 and the second columninterlayer-connection unit 220. Each of the column unit circuits CU mayinclude a comparator, a counter etc. to convert an analog signal fromthe corresponding column data line CDL to a digital signal. The columnunit circuits CU may be arranged in the row direction X to be matchedwith the second column bonding pads PAD2. As a result, the pitch PTX1between the pixels columns may be equal to the pitch PTX2 between thecolumn unit circuits CU. The second column interlayer-connection unit220 as well as the first column interlayer-connection unit 120 is placedin a parallel-translated position along (i.e., may be offset in) the rowdirection X with respect to the pixel array 110 such that therow-directional center position CX2 of the second columninterlayer-connection unit 220 is different from the row-directionalcenter position CX1 of the pixel array 110.

The design margin may be secured and restriction of the circuitdisposition may be relieved if the pitch PTX2 between the column unitcircuits CU is smaller than the pitch PTX1 between the pixel columns.However, the design margin is decreased and the restrictions to thecircuit disposition are increased as the integration degree and theresolution of the pixel array are increased. When the pitch PTX1 betweenthe pixel columns is about 1 μm (micrometer), it is difficult tofabricate the column unit circuits CU having the pitch PTX2 smaller thanthe pitch PTX1 between the pixel columns In this case, the columncontrol circuit 230 and the row control circuit 250 would be inevitablysuperimposed in the second semiconductor die 200 and thus, the size ofthe image sensor has to be increased so that the column control circuit230 and the row control circuit 250 are not superimposed. The stackedimage sensor according to examples may increase a margin of circuitdesign and decrease a size of an image sensor by adopting the sliderouting structure in which the routing wires are linear wires extendinglengthwise in the diagonal direction.

In case of a spider routing structure in which the pitch PTX2 betweenthe column unit circuits CU is smaller than the pitch PTX1 between thepixel columns, the operational characteristics of the image sensor maybe degraded because the routing lengths are different column by column.In contrast, and according to examples of image sensors according to theinventive concept, the pitch PTX2 between the column unit circuits CU isequal to the pitch PTX1 between the pixel columns and the parallelcolumn routing wires 130 have the same lengths. The loads along theconductive paths between the pixel array 110 and the column controlcircuit 230 may be uniform by virtue of the slide routing structure toenhance the performance of the stacked image sensor and the systemincluding the stacked image sensor.

Referring to FIG. 4, the pixel rows of the pixel array 110 of the firstsemiconductor die 100 may be connected respectively to the row selectionlines RSL as illustrated in FIG. 5. A pitch PTY1 between the pixel rowsmay be an interval between the two adjacent row selection lines RSL. Thefirst row interlayer-connection unit 140 may include first row bondingpads PAD3 arranged in the column direction Y. The first row bonding padsPAD3 may be disposed on a surface of the first semiconductor die 100that is bonded to a surface to the second semiconductor die 200. The rowrouting wires 150 may be of the dielectric layer of the firstsemiconductor die 100 and thus the row routing wires 150 may beconnected to the first row bonding pads PAD3 on the surface of the firstsemiconductor die 100 through vertical contacts.

According to examples, the row routing wires 150 may extend linearly inthe diagonal direction to connect the row selection lines RSL and thefirst row bonding pads PAD3, respectively. A column-directional lengthLY1 of the pixel array 110 may be equal to a column-directional lengthof the first row interlayer-connection unit 140 and the row routingwires 150 may be parallel to each other. The first rowinterlayer-connection unit 140 may be placed in a parallel-translatedposition along (i.e., may be offset in) the column direction Y withrespect to the pixel array 110 such that a column-directional centerposition CY2 of the first row interlayer-connection unit 140 isdifferent from a column-directional center position CY1 of the pixelarray 110.

The second row interlayer-connection unit 240 may be disposed in thesecond semiconductor die 100 at a position corresponding to the firstrow interlayer-connection unit 140 so that the second rowinterlayer-connection unit 240 may be connected to the first rowinterlayer-connection unit 140 when the first semiconductor die 100 andthe second semiconductor die 200 are stacked. The second rowinterlayer-connection unit 240 may include second row bonding pads PAD4arranged in the column direction Y that are connected to the first rowbonding pads PAD3 when the semiconductor dies 100 and 200 are stacked.The second row bonding pads PAD4 may be disposed on a surface of thesecond semiconductor die 200 that is bonded to a surface to the firstsemiconductor die 100.

The row control circuit 250 may include a plurality of row unit circuitsRU respectively connected to the pixel rows, that is, to the rowselection lines CDL, through the row routing wires 150, the first rowinterlayer-connection unit 140 and the second row interlayer-connectionunit 240. Each of the row unit circuits RU may include a driver to applya predetermined voltage to the corresponding row selection line RSL. Therow unit circuits RU may be arranged in the column direction Y to bematched with the second row bonding pads PAD4. As a result, the pitchPTY1 between the pixels rows may be equal to the pitch PTY2 between therow unit circuits RU. The second row interlayer-connection unit 240 aswell as the first row interlayer-connection unit 140 is placed in aparallel-translated position along (i.e., may be offset in) the columndirection Y with respect to the pixel array 110 such that thecolumn-directional center position CY2 of the second rowinterlayer-connection unit 240 may be different from thecolumn-directional center position CY1 of the pixel array 110.

In the examples described above, implementing a slide routing structureas the row routing wires 150 and/or the column routing wires 130 in astacked image sensor according to the inventive concept, maximizes themargin of circuit design and allows the size of the image sensor to byminimized

FIG. 5 is a block diagram illustrating an example of the elements ofdies in a stacked image sensor according to the inventive concept.

Referring to FIG. 5, a stacked image sensor 10 may include a firstsemiconductor die 100 and a second semiconductor die 200. As describedabove, a pixel array 110 may be provided in the first semiconductor die100 and other circuits such as a column control circuit CCC 230, a rowcontrol circuit RCC 250, a timing controller TMC 260, a reference signalgenerator REF 270, a digital circuit DGT 280, etc. may be provided inthe second semiconductor die 200.

The pixel array 110 may include a plurality of pixels PX that arearranged in a plurality of pixel rows and a plurality of pixel columns.The configuration and the operation of the pixels PX are described belowwith reference to FIGS. 7A through 7D. The pixels PX in the same pixelrow may be commonly connected to a respective row selection line RSL andthe pixels PX in the same pixel column may be commonly connected to arespective column data line CDL.

A first column interlayer-connection unit 120 and column routing wires130 of the first semiconductor die 100 and a second columninterlayer-connection unit 220 of the second semiconductor die 200 mayconnect the pixel columns of the pixel array 110 disposed in the firstsemiconductor die 100 and the column control circuit 230 disposed in thesecond semiconductor die 200. A first row interlayer-connection unit 140and row routing wires 150 of the first semiconductor die 100 and asecond row interlayer-connection unit 240 of the second semiconductordie 200 may connect the pixel rows of the pixel array 110 of the firstsemiconductor die 100 and the row control circuit 250. As describedabove, the column routing wires 130 and/or the row routing wires 150 mayhave a slide routing structure, i.e., all of the column routing wires130 and/or all of the row routing wires 150 may be linear wiresextending parallel to each other in a diagonal direction.

The column control circuit 230 may include comparators, counters andcorrelated double sampling circuits to convert the analog signals fromthe pixel columns in the pixel array 110 to digital signals. The rowcontrol circuit 250 may include drivers to apply predetermined voltagesto the pixel rows in the pixel array 110. The reference signal generator270 may generate a reference signal such as a ramp signal that isprovided to the column control circuit 230. The digital circuit 280 mayinclude an image signal processor to process the digital signals formthe column control circuit 230, an interface circuit to input and outsignals, a voltage providing circuit, etc. The timing controller 260 maygenerate control signals to control overall operations of the stackedimage sensor 10 and the control signals may be provided to thecorresponding circuits.

FIGS. 6A and 6B are diagrams illustrating a layout of a stacked imagesensor according to examples.

Referring to FIGS. 6A and 6B, a first semiconductor die 100 may includea pixel array 110, a first column interlayer-connection unit 120, columnrouting wires 130, a first row interlayer-connection unit 140 and rowrouting wires 150. A second semiconductor die 200 may include a secondcolumn interlayer-connection unit 220, a column control circuit CCC 230,a second row interlayer-connection unit 240, a row control circuit RCC250 and a digital circuit DGT 280

As described above, the column routing wires 130 and/or the row routingwires 150 may have the slide routing structure such that the wiresextend linearly in a diagonal direction. The diagonal direction may bean arbitrary direction that is parallel with the top and bottom surfacesof the semiconductor die and is not parallel with the row direction Xand the column direction Y. Using such slide routing structure, thestacked image sensor 10 may maximize a margin of circuit design and thesize of the image sensor may be minimized In addition, the loads alongthe conductive paths between the pixel array 110 and the column controlcircuit 230 and/or between the pixel array 110 and the row controlcircuit 250 may be uniform to enhance the performance of the stackedimage sensor 10 and the system including the stacked image sensor 10.

As illustrated in FIG. 6B, the column control circuit 230 may bedisposed adjacent to the second column interlayer-connection unit 220and the row control circuit 250 may be disposed adjacent to the secondrow interlayer-connection unit 240. As described with reference to FIG.3, the column control circuit 230 may include the column unit circuitsCU corresponding to the pixel columns The column unit circuits CU may bearranged in the row direction to be matched with the second columnbonding pads PAD2 in the second column interlayer-connection unit 220.As described with reference to FIG. 4, the row control circuit 250 mayinclude the row unit circuits RU corresponding to the pixel rows. Therow unit circuits RU may be arranged in the column direction to bematched with the second row bonding pads PAD4 in the second rowinterlayer-connection unit 240.

The digital circuit 280 may occupy a relatively wide area because itincludes various circuits such as an image signal processor, a storageblock, an interface circuit, a voltage providing circuit, etc. Indesigning the stacked image sensor, the column control circuit 230 andthe row control circuit 250 are laid out first and then the digitalcircuit 280 may be laid out in the remaining region of the die 200.

In an example, as illustrated in FIGS. 6A and 6B, the first columninterlayer-connection unit 120 may be offset in one horizontal directionparallel to an upper surface of the die 100 (to the left in the figure)with respect to the pixel array 110 and the first rowinterlayer-connection unit 140 may be offset in another horizontaldirection (upwards in the figure) with respect to the pixel array 110.In this case, an unoccupied region may be secured in a corner of the die100 corresponding to a corner region CON 261 of the die 200(right-bottom portion of the second semiconductor die 200 in thefigure). The timing controller for controlling overall operations of thestacked image sensor and/or the reference signal generator for providingthe reference signal to the column control circuit 230 may be disposedin the corner region CON 261 of the second semiconductor die 200. Assuch, the circuits are disposed efficiently and the size of the imagesensor is minimized

FIGS. 7A through 7D are diagrams illustrating examples of pixelsemployed in the stacked image sensor of FIG. 5.

The pixels 20 a, 20 b, 20 c and 20 d illustrated in FIGS. 7A, 7B, 7C and7D may be color pixels for detecting color image information or depthpixels for detecting distance information.

Referring to FIG. 7A, the pixel 20 a may include a photo-sensitiveelement such as a photodiode PD, and a readout circuit including atransfer transistor TX, a reset transistor RX, a drive transistor DX anda selection transistor SX.

For example, the photodiode PD may include an n-type region in a p-typesubstrate such that the n-type region and the p-type substrate form ap-n junction diode. The photodiode PD receives the incident light andgenerates a photo-charge based on the incident light. In some examples,the pixel 20 a may include a photo transistor, a photo gate, a pinnedphoto diode, etc. instead of or in addition to the photodiode PD.

The photo-charge generated in the photodiode PD may be transferred to afloating diffusion node FD through the transfer transistor TX, which isturned on in response to a transfer control signal TG The drivetransistor DX functions as a source follower amplifier that amplifies asignal corresponding to the charge on the floating diffusion node FD.The selection transistor SX may transfer the amplified signal to acolumn data line CDL in response to a selection signal SEL that isprovided through a row selection line RSL. The floating diffusion nodeFD may be reset by the reset transistor RX. For example, the resettransistor RX may discharge the floating diffusion node FD in responseto a reset signal RS for correlated double sampling (CDS).

The pixels in the same row may be connected commonly to a respective rowselection line to form a pixel row. The pixels in the same column may beconnected commonly to the a respective column data line to form a pixelcolumn.

FIG. 7A illustrates the pixel 20 a as having a four-transistorconfiguration including the four transistors TX, RX, DX and SX. Pixelsof an image sensor according to the inventive concept may, however, haveother configurations as illustrated in FIGS. 7B, 7C and 7D.

Referring to FIG. 7B, the pixel 20 b may have the three-transistorconfiguration including a photo-sensitive element such as a photodiodePD, and a readout circuit including a reset transistor RX, a drivetransistor DX and a selection transistor SX.

Referring to FIG. 7C, the pixel 20 c may have the five-transistorconfiguration including a photo-sensitive element such as a photodiodePD, and a readout circuit including a transfer transistor TX, a gatetransistor GX, a reset transistor RX, a drive transistor DX and aselection transistor SX. The gate transistor GX may selectively applythe transfer control signal TG to the transfer transistor TX in responseto the selection signal SEL.

Referring to FIG. 7D, the pixel 20 d may have the five-transistorconfiguration including a photo-sensitive element such as a photodiodePD, and a readout circuit including a photo transistor PX, a transfertransistor TX, a reset transistor RX, a drive transistor DX and aselection transistor SX. The photo transistor PX may be turned on or offin response to a photo gate signal PG The pixel 20 d may be enabled whenthe photo transistor PX is turned on and disabled when the phototransistor PX is turned off. In addition, the pixel may havesix-transistor configuration, e.g., may further include the gatetransistor GX of FIG. 7C (or a bias transistor) in addition to thetransistors of the configuration of FIG. 7D.

FIG. 8 is a cross-sectional view of a stacked image sensor according toan example, and FIG. 9 is a diagram illustrating a slide routingstructure implemented in the stacked image sensor of FIG. 8.

Referring to FIG. 8, a stacked image sensor 11 may include a firstsemiconductor die 101 and a second semiconductor die 201 that arestacked in a vertical direction Z.

The first semiconductor die 101 includes a first semiconductor substrateSUB1 and a first dielectric layer DLY1 formed on the first semiconductorsubstrate SUB1. The pixels PX are part of the first semiconductorsubstrate SUB1 and first conductive paths connected to the pixels PX areprovided in the first dielectric layer DLY1. The column data line CDL,the column routing wire 131 and vertical contacts VC, as examples ofelements that form the first conductive paths, are illustrated in FIG.8. The column data line CDL may be connected to the pixels PX throughthe vertical contacts VC. The vertical contacts may be connected to theactive regions AR of the pixels PX. Color filters CF and micro-lensesmay be disposed on the pixels PX to receive incident light.

The second semiconductor die 201 includes a second semiconductorsubstrate SUB2 and a second dielectric layer DLY2 formed on the secondsemiconductor substrate SUB2. The column unit circuit CU is part of thesecond semiconductor substrate SUB2 and second conductive pathsconnected to the column unit circuit CU are provided in the seconddielectric layer DLY2. Metal patterns MP and vertical contacts VC, asexamples of the elements that provide the second conductive paths, areillustrated in FIG. 8. The column routing wires 131 may be connected tothe column unit circuit CU through the vertical contacts VC and themetal patterns MP.

As illustrated in FIG. 8, the first semiconductor die 101 and the secondsemiconductor die 201 may be stacked such that a top surface of thefirst dielectric layer DLY1 and a top surface of the second dielectriclayer DLY2 are bonded to each other. In other words, the firstsemiconductor die 101 may be stacked in an upside-down state. As aresult, the stacked image sensor 11 may be a back-side-illuminatedsensor such that incident light rays are received through a bottomsurface of the first semiconductor substrate SUB1.

The first column interlayer-connection unit 120 may include first columnbonding pads PAD1 arranged in the row direction X on the top surface ofthe first dielectric layer DLY1 and first vertical contacts VCconnecting the column routing wires 131 of the first dielectric layerDLY1 and the first column bonding pads PAD1. The second columninterlayer-connection unit 220 may include second column bonding padsPAD2 arranged in the row direction X on the top surface of the seconddielectric layer DLY2 and second vertical contacts VC connecting thecolumn control circuit, that is, the column unit circuits CU of thesecond semiconductor substrate SUB2 and the second column bonding padsPAD2. Vertical contacts VC at different levels and horizontal positionsmay be connected by the metal patterns MP.

As illustrated in FIGS. 8 and 9, the column data lines CDL and thecolumn routing wires 131 may be of the same metal layer. In this case,each column data line CDL and each column routing wire 131 may be formedmonolithically through the same metallization process. The columnrouting wires 131 may extend in the diagonal direction and parallel toeach other. Accordingly the column data lines CDL, the column routingwires 131, the first column interlayer-connection unit 120 and thesecond column interlayer-connection unit 220 corresponding to therespective columns may be contiguous and constitute a unitary structure.The loads along the conductive paths between the pixel array and thecolumn control circuit may be kept uniform by using the slide routingstructure to enhance the performance of the stacked image sensor and thesystem including the stacked image sensor.

FIG. 10 is a cross-sectional view of a stacked image sensor according toanother example, and FIG. 11 is a diagram illustrating a slide routingstructure in the stacked image sensor of FIG. 10.

Referring to FIG. 10, a stacked image sensor 12 may include a firstsemiconductor die 102 and a second semiconductor die 202 that arestacked in a vertical direction Z.

The first semiconductor die 102 includes a first semiconductor substrateSUB1 and a first dielectric layer DLY1 formed on the first semiconductorsubstrate SUB1. The pixels PX are part of the first semiconductorsubstrate SUB1 and first conductive paths connected to the pixels PX areprovided in the first dielectric layer DLY1. The column data line CDL,the column routing wire 132 and vertical contacts VC, as examples of theelements providing the first conductive paths, are illustrated in FIG.10. The column data line CDL may be connected to the pixels PX throughthe vertical contacts VC. The vertical contacts may be connected to theactive regions AR of the pixels PX. Color filters CF and micro-lensesmay be disposed on the pixels PX to receive incident light.

The second semiconductor die 202 includes a second semiconductorsubstrate SUB2 and a second dielectric layer DLY2 formed on the secondsemiconductor substrate SUB2. The column unit circuit CU is part of thesecond semiconductor substrate SUB2 and second conductive pathsconnected to the column unit circuit CU are provided in the seconddielectric layer DLY2. The metal patterns MP and the vertical contactsVC, as examples of the elements providing the second conductive paths,are illustrated in FIG. 10. The column routing wire 132 may be connectedto the column unit circuit CU through the vertical contacts VC and themetal patterns MP.

As illustrated in FIG. 10, the first semiconductor die 102 and thesecond semiconductor die 202 may be stacked such that a top surface ofthe first dielectric layer DLY1 and a top surface of the seconddielectric layer DLY2 are bonded to each other. In other words, thefirst semiconductor die 102 may be stacked in an upside-down state. As aresult, the stacked image sensor 12 may be a back-side-illuminatedsensor such that the incident light rays are received through a bottomsurface of the first semiconductor substrate SUB 1.

The first column interlayer-connection unit 120 may include first columnbonding pads PAD1 arranged in the row direction X on the top surface ofthe first dielectric layer DLY1 and first vertical contacts VCconnecting the column routing wires 131 of the first dielectric layerDLY1 and the first column bonding pads PAD1. The second columninterlayer-connection unit 220 may include second column bonding padsPAD2 arranged in the row direction X on the top surface of the seconddielectric layer DLY2 and second vertical contacts VC connecting thecolumn control circuit, that is, the column unit circuits CU of thesecond semiconductor substrate SUB2 and the second column bonding padsPAD2. Vertical contacts VC at different levels and horizontal positionsmay be connected through the metal patterns MP.

As illustrated in FIGS. 10 and 11, the column data lines CDL and thecolumn routing wires 131 may be of different metal layers. In this case,each column data line CDL and each column routing wire 131 may be formedsequentially through different metallization processes and the verticalcontacts connecting the column data lines CDL and the column routingwires 130 may be further formed. The column routing wires 132 may extendin the diagonal direction and parallel to each other. Accordingly thecolumn data lines CDL, the column routing wires 132, the first columninterlayer-connection unit 120 and the second columninterlayer-connection unit 220 corresponding to the respective columnsmay together form an integral structure. The loads along the conductivepaths between the pixel array and the column control circuit may be keptuniform by the slide routing structure to enhance the performance of thestacked image sensor and the system including the stacked image sensor.

FIG. 12 is a cross-sectional view of a stacked image sensor according toanother example.

Referring to FIG. 12, a stacked image sensor 13 may include a firstsemiconductor die 103 and a second semiconductor die 203 that arestacked in a vertical direction Z.

The first semiconductor die 103 includes a first semiconductor substrateSUB1 and a first dielectric layer DLY1 formed on the first semiconductorsubstrate SUB1. The pixels PX are part of the first semiconductorsubstrate SUB1 and first conductive paths connected to the pixels PX areprovided by the first dielectric layer DLY1. The column data line CDL,the column routing wire 133 and vertical contacts VC, as examples ofelements that provide the first conductive paths, are illustrated inFIG. 12. The column data line CDL may be connected to the pixels PXthrough the vertical contacts VC. The vertical contacts may be connectedto the active regions AR of the pixels PX. Color filters CF andmicro-lenses may be disposed on the pixels PX to receive incident light.

The second semiconductor die 203 includes a second semiconductorsubstrate SUB2 and a second dielectric layer DLY2 formed on the secondsemiconductor substrate SUB2. The column unit circuit CU is part of thesecond semiconductor substrate SUB2 and second conductive pathsconnected to the column unit circuit CU are provided by the seconddielectric layer DLY2. The metal patterns MP and the vertical contactsVC, as examples of elements that provide, the second conductive pathsare illustrated in FIG. 12. The column routing wire 133 may be connectedto the column unit circuit through the vertical contacts VC and themetal patterns MP.

As illustrated in FIG. 12, the first semiconductor die 103 and thesecond semiconductor die 203 may be stacked such that a bottom surfaceof the first semiconductor substrate SUB1 and a top surface of thesecond dielectric layer DLY2 are bonded to each other. In other words,the first semiconductor die 103 may stacked right side up. As a result,the stacked image sensor 13 may be a front-side-illuminated sensor suchthat the incident light rays are received through a top surface of thefirst dielectric layer DLY1.

The first column interlayer-connection unit 120 may include first columnbonding pads PAD1 arranged in the row direction X on the bottom surfaceof the first semiconductor substrate SUB and through-substrate vias TSVpenetrating the first semiconductor substrate SUB1 to connect the columnrouting wires 133 of the first dielectric layer DLY1 and the firstcolumn bonding pads PAD1. The second column interlayer-connection unit220 may include second column bonding pads PAD2 arranged in the rowdirection X on the top surface of the second dielectric layer DLY2 andsecond vertical contacts VC connecting the column control circuit, thatis, the column unit circuits CU of the second semiconductor substrateSUB2 and the second column bonding pads PAD2. Vertical contacts VC atdifferent levels and horizontal positions may be connected by the metalpatterns MP.

The column data lines CDL and the column routing wires 133 may be of thesame metal layer as described with reference to FIGS. 8 and 9 or may beof different metal layers as described with reference to FIGS. 10 and11. The column routing wires 133 may extend in the diagonal directionand parallel to each other. Accordingly the column data lines CDL, thecolumn routing wires 133, the first column interlayer-connection unit120 and the second column interlayer-connection unit 220 correspondingto the respective columns may together constitute and unitary orintegral structure. The loads along the conductive paths between thepixel array and the column control circuit may be kept uniform by theslide routing structure to enhance the performance of the stacked imagesensor and the system including the stacked image sensor.

The examples of FIGS. 8 through 12 have been described with reference tothe column routing wires being in the form of a slide routing structure.In the same way, the row routing wires may be implemented in the form ofa slide routing structure.

FIG. 13 is a diagram of an example of manufacturing processes of astacked image sensor.

Referring to FIG. 13, a plurality of pixel arrays may be formed as parts(dies) of a first wafer WF1 and other circuits may be formed as parts(dies) of a second wafer WF2. According to examples, the pixels arraysof the first wafer WF1 may be connected to the circuits in the secondwafer WF2 using slide routing structure. After the pixel arrays and theother circuits have been fabricated, the first wafer WF1 and the secondwafer WF2 are bonded. The above-mentioned first column and row bondingpads PAD1 and PAD3 may be formed at a bottom surface of the first waferWF1 and the above-mentioned second column and row bonding pads PAD2 andPAD4 may be formed at a top surface of the second wafer WF2. The firstand second wafers WF1 and WF2 may be aligned so that the correspondingpads may be bonded to each other. The bonded wafers WF1 and WF2 are cutand divided into a plurality of chips where each chip corresponds to theabove-mentioned stacked image sensor 10. Each separated portion of thewafer WF1 corresponds to the above-mentioned first semiconductor die 100and each separated portion of the second wafer WF2 corresponds to theabove-mentioned second semiconductor die 200.

FIG. 14 is a diagram illustrating an example of a camera systemincluding a stacked image sensor according to the inventive concept.

Referring to FIG. 14, a camera system 800 may include a photo-receivinglens 810, an image capturing device 900 and an engine unit 840. Theimage capturing device 900 may include a stacked image sensor chip 820and a light source module 830. According to examples, the stacked imagesensor chip 820 may include the slide routing structure so as to beminiaturized and offer an enhanced performance. The stacked image sensorchip 820 and the light source module 830 may be separated devices, or atleast a portion of the light source module 830 may be provided as partof the stacked image sensor chip 820. In some examples, thephoto-receiving lens 810 may be part of the three-dimensional imagesensor chip 820.

The photo-receiving lens 810 may focus incident light on aphoto-receiving region (e.g., depth pixels and/or color pixels of apixel array) of the stacked image sensor chip 820. The stacked imagesensor chip 820 may generate data DATA1 including depth informationand/or color image information based on the incident light passingthrough the photo-receiving lens 810. For example, the data DATA1generated by the stacked image sensor chip 820 may include depth datagenerated using infrared light or near-infrared light emitted from thelight source module 830 and red, green, blue (RGB) data of a Bayerpattern generated using external visible light. The stacked image sensorchip 820 may provide the data DATA1 to the engine unit 840 based on aclock signal CLK. In some examples, the stacked image sensor chip 820may interface with the engine unit 840 via mobile industry processorinterface (MIPI®) and/or camera serial interface (CSI).

The engine unit 840 controls the image capturing device 900. The engineunit 840 may process the data DATA1 received from the three-dimensionalimage sensor chip 820. For example, the engine unit 840 may generatethree-dimensional color data based on the data DATA1 received from thestacked image sensor chip 820. In other examples, the engine unit 840may generate luminance, chrominance (YUV) data including a luminancecomponent Y, a blue-luminance difference component U, and ared-luminance difference component V based on the RGB data included inthe data DATA1, or compressed data, such as Joint Photographic ExpertsGroup (JPEG) data. The engine unit 840 may be connected to ahost/application 850 and may provide data DATA2 to the host/application850 based on a master clock MCLK. Furthermore, the engine unit 840 mayinterface with the host/application 850 via serial peripheral interface(SPI) and/or inter integrated circuit (I2C).

FIG. 15 is a diagram illustrating an example of a computer systemincluding a stacked image sensor according to the inventive concept.

Referring to FIG. 15, a computer system 1000 may include a processor1010, a memory device 1020, a storage device 1030, an input/outputdevice 1040, a power supply 1050, and a stacked image sensor 900.Although not illustrated in FIG. 15, the computer system 1000 mayfurther include ports that communicate with a video card, a sound card,a memory card, a universal serial bus (USB) device, and/or otherelectronic devices.

The processor 1010 may perform various calculations or tasks. Theprocessor 1010 may be a microprocessor or a central processing unit(CPU). The processor 1010 may communicate with the memory device 1020,the storage device 1030, and the input/output device 1040 via an addressbus, a control bus, and/or a data bus. In some examples, the processor1010 may be coupled to an extended bus, such as a peripheral componentinterconnection (PCI) bus. The memory device 1020 may store data foroperating the computer system 1000. For example, the memory device 1020may comprise a dynamic random access memory (DRAM) device, a mobile DRAMdevice, a static random access memory (SRAM) device, a phase randomaccess memory (PRAM) device, a ferroelectric random access memory (FRAM)device, a resistive random access memory (RRAM) device, and/or amagnetic random access memory (MRAM) device. The storage device maycomprise a solid state drive (SSD), a hard disk drive (HDD), acompact-disc read-only memory (CD-ROM), or the like. The input/outputdevice 1040 may include an input device (e.g., a keyboard, a keypad, ora mouse) and an output device (e.g., a printer or a display device). Thepower supply 1050 supplies operation voltages for the computer system1000.

The stacked image sensor 900 may communicate with the processor 1010 viathe buses or other communication links. The stacked image sensor 900 maybe integrated with the processor 1010 in one chip, or the stacked imagesensor 900 and the processor 1010 may be separate chips. According toexamples, the stacked image sensor 900 may include the slide routingstructure so as to be miniaturized and offer an enhanced performance.

The computer system 1000 may be packaged in various forms, such aspackage on package (PoP), ball grid arrays (BGAs), chip scale packages(CSPs), plastic leaded chip carrier (PLCC), plastic dual in-line package(PDIP), die in waffle pack, die in wafer form, chip on board (COB),ceramic dual in-line package (CERDIP), plastic metric quad flat pack(MQFP), thin quad flat pack (TQFP), small outline integrated circuit(SOIC), shrink small outline package (SSOP), thin small outline package(TSOP), system in package (SIP), multi-chip package (MCP), wafer-levelfabricated package (WFP), or wafer-level processed stack package (WSP).

The computer system 1000 may be any system having an image sensor. Forexample, the computer system 1000 may be a digital camera, a mobilephone, a smart phone, a portable multimedia player (PMP), or a personaldigital assistant (PDA).

FIG. 16 is a block diagram illustrating a computer system of a type moregenerally shown in FIG. 15.

Referring to FIG. 16, a computer system 1100 may be a data processingdevice that uses or supports a mobile industry processor interface(MIPI®) interface. The computer system 1100 may include an applicationprocessor 1110, a three-dimensional image sensor 1140, a display device1150, etc. A CSI host 1112 of the application processor 1110 may performa serial communication with a CSI device 1141 of the three-dimensionalimage sensor 1140 via a camera serial interface (CSI). In some examples,the CSI host 1112 may include a deserializer (DES), and the CSI device1141 may include a serializer (SER). A DSI host 1111 of the applicationprocessor 1110 may perform a serial communication with a DSI device 1151of the display device 1150 via a display serial interface (DSI).

In some examples, the DSI host 1111 may include a serializer (SER), andthe DSI device 1151 may include a deserializer (DES). The computersystem 1100 may further include a radio frequency (RF) chip 1160performing a communication with the application processor 1110 and aDigRFSM slave 1162 providing communication with other devices. Aphysical layer (PHY) 1113 of the computer system 1100 and a physicallayer (PHY) 1161 of the RF chip 1160 may perform data communicationsbased on a MIPI® DigRFSM. The application processor 1110 may furtherinclude a DigRFSM MASTER 1114 that controls the data communications ofthe PHY 1161.

The computer system 1100 may further include a global positioning system(GPS) 1120, a storage 1170, a MIC 1180, a DRAM device 1185, and aspeaker 1190. In addition, the computer system 1100 may performcommunications using an ultra-wideband (UWB) 1210, a wireless local areanetwork (WLAN) 1220, and a worldwide interoperability for microwaveaccess (WIMAX) 1230. However, the structure and the interface of thecomputer system 1100 are not limited thereto.

The inventive concept may be applied to various devices and systems. Forexample, the inventive concept may be applied to a mobile phone, a smartphone, a personal digital assistant (PDA), a portable multimedia player(PMP), a digital camera, a camcorder, personal computer (PC), a servercomputer, a workstation, a laptop computer, a digital TV, a set-top box,a portable game console, or a navigation system.

Finally, examples of the inventive concept have been described above indetail. The inventive concept may, however, be put into practice in manydifferent ways and should not be construed as being limited to theexamples described above. Rather, these examples were described so thatthis disclosure is thorough and complete, and fully conveys theinventive concept to those skilled in the art. Thus, the true spirit andscope of the inventive concept is not limited by the examples describedabove but by the following claims.

What is claimed is:
 1. An image sensor comprising first and second diesstacked one on the other and joined to each other, the first dieincluding a semiconductor substrate, a pixel array, and routing wires,and the second die including a semiconductor substrate, and pixel arraycontrol circuitry, and wherein the pixel array comprises rows andcolumns of pixels, column data lines each of which electrically connectsthe pixels in a respective column of the pixels, and row selection lineseach of which electrically connects the pixels in a respective row ofthe pixels, the pixels in each of the rows being arrayed in a firstdirection, and the pixels in each of the columns being arrayed in asecond direction, the routing wires comprise column routing wireselectrically connected to the column data lines at ends of the columndata lines, respectively, and by which all of the pixels of the pixelarray are electrically connected to the pixel array control circuitry ofthe second die, and row routing wires electrically connected to the rowselection lines at ends of the row selection lines, respectively and bywhich all of the pixels of the pixel array are electrically connected tothe pixel array control circuitry of the second die, and all of the rowrouting wires and/or all of the column routing wires are linear, andextend lengthwise within the same layer in the first die parallel to oneanother in a diagonal direction that subtends acute angles with thefirst and second directions, respectively.
 2. The image sensor of claim1, wherein the column data lines each extend linearly in the firstdirection in the same metal layer in the sensor as the column routingwires, the first die includes interlayer electrical connectionsextending vertically in a region of the first die adjacent the pixelarray, and electrically connected to the column routing lines, and allof the column routing wires extend linearly in the diagonal directionfrom the ends of the column data lines to the interlayer electricalconnections such that the column data lines and the column routing linesare unitary.
 3. The image sensor of claim 1, wherein the row selectionlines each extend linearly in the second direction in the same metallayer in the sensor as the row routing wires, the first die includesinterlayer electrical connections extending vertically in a region ofthe first die adjacent the pixel array, and electrically connected tothe row routing lines, and all of the row routing wires extend linearlyin the diagonal direction from the ends of the row selection lines tothe interlayer electrical connections such that the column data linesand the row routing lines are unitary.
 4. The image sensor of claim 1,wherein the column data lines each extend linearly in the firstdirection in a different metal layer in the sensor from the columnrouting wires, the first die includes vertical contacts extendingvertically in the first die from the ends of the column data lines,respectively, and interlayer electrical connections extending verticallyin a region of the first die adjacent the pixel array, and all of thecolumn routing wires extend linearly in the diagonal direction from thevertical contacts to the interlayer electrical connections and areelectrically connected to the vertical contacts and the interlayerelectrical connections.
 5. The image sensor of claim 1, wherein the rowselection lines each extend linearly in the second direction in adifferent metal layer in the sensor from the row routing wires, verticalcontacts extending vertically in the first die from the ends of thecolumn data lines, respectively, and interlayer electrical connectionsextending vertically in a region of the first die adjacent the pixelarray, and all of the row routing wires extend linearly in the diagonaldirection from the vertical contacts to the interlayer electricalconnections and are electrically connected to the vertical contacts andthe interlayer electrical connections.
 6. The image sensor of claim 1,wherein the pixel array control circuitry includes an analog to digitalconverter to which the columns of pixels are respectively electricallyconnected by the column routing wires, and drivers configured to applyvoltages to the rows of the pixels and to which the rows of pixels arerespectively electrically connected by the row routing wires.